Previous (2012) Technical Conference Program

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• CAR-K Block

  

  CAR-K Keynote Session

  Jan. 18 [Wed] 10:30-12:30 Leading Manufacturers Discuss Future Automotive Electronics for Next-generation Vehicles

  Rapidly Changing Automotive Industry and its Expectations for Car Electronics	Volkswagen Group Strategy for Electric Mobility	Ford's Sustainable Electrification Approach
  Moritaka Yoshida Managing Officer, Toyota Motor Corp.	Rudolf Krebs Executive Vice President, Head of Group E-Traction, Volkswagen AG	Nancy Gioia Director, Global Electrification, Ford Motor Company

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  ＜Other Sessions＞

  All Sessions Available in English / Japanese

• CAR-1 Market Outlook and Development Technology of Latest HEVs Jan. 18 [Wed] 13:30-16:00	CAR-6 Analysts Talk: Keys to Success in New Emerging Countries Jan. 18 [Wed] 13:30-16:00
  Senior Manager, Powertrain Product Development Dept. No.4, Nissan Motor Co., Ltd. Koichi Hayasaki Senior Engineer, Engineering Electrification Customer Projects, Robert Bosch GmbH Volker Barth Managing Director, Fundamental Analysis, Citi Investment Research & Analysis, Citigroup Global Markets Japan Inc. Noriyuki Matsushima	Senior Manager, Deloitte Tohmatsu Consulting Co., Ltd. Lei Zhou Director, Bangkok Office, IHS Automotive Hajime Yamamoto Senior Analyst, Autofacts,　 PricewaterhouseCoopers LLP　 Tsukasa Watanabe

• CAR-2 Recent Trends in EV Development ―Strategies of Honda, Tesla and GM― Jan. 19 [Thur] 9:30-12:00

  CAR-7 Leading-edge Technology Trends for Fuel Consumption Improvement Jan. 19 [Thur] 9:30-12:00

  Chief Engineer, Dept. 1, Technology Research Div. 5, Honda R&D Co., Ltd. Automobile R&D Center Kenichiro Kimura Senior Manager, Communications and Public Affair, Japan and Asia Pacific, Tesla Motors Atsuko Doi Senior Manager, R&D Science Office, General Motors Japan Ltd. Masato Sato

  Executive Officer, General Manager Powertrain Development Div., Assistant to the Officer in Charge of Cost Innovation, Mazda Motor Corp. Mitsuo Hitomi Chief Engineer, Manager, Dept. 2, Technology Development Div. 3, Honda R&D Co., Ltd. Automobile R&D Center Eisuke Kimura Chief Project Manager, Powertrain & Electronic Control System Div., Powertrain Design Div., Control System Design Dept., Hitachi Automotive Systems, Ltd. Minoru Osuga

• CAR-3 Forefront of Motor and Inverter Development Jan. 19 [Thur] 13:30-16:00	CAR-8 Functional Safety: Latest Information on ISO-26262 and Corporate Efforts Jan. 19 [Thur] 13:30-16:00
  Manager, Electric Motor Engineering Group, EV Powertrain Engineering Dept., Nissan Motor Co., LTD. Tadaaki Iiyama Professor, Graduate School of Information Science & Technology, Hokkaido University Satoshi Ogasawara Vice President (Automotive Business Operations), Nidec Corp. Kazuya Hayafune	General Manager, Vehicle Control System Development Process Planning Dept., Vehicle Control System Development Div., Toyota Motor Corp. Ryo Ito Section Manager, E/E Architecture Promotion Gr., Advanced Technology R&D Dept., Technical Center, Bosch Corp. Junichi Ochi Director Product Marketing, Powertrain Microcontroller, Infineon Technologies AG Joachim Kahmann

• CAR-4 Marketing Prospects and Further Technology Development of Secondary Batteries Jan. 20 [Fri] 9:30-12:00	CAR-9 Automotive Electronics Technology and its Safety Contribution Jan. 20 [Fri] 9:30-12:00
  General Manager,Battery Research Div., Toyota Motor Corp. Hideki Iba General Manager, Development Dept. I, Development Div., Lithium-ion Battery Business Unit, GS Yuasa International Ltd. Koichi Nishiyama Vice President, Institute of Information Technology, Ltd. Hideo Takeshita	Chief Engineer, Dept. 2, Technology Development Div. 8, Honda R&D Co., Ltd. Automobile R&D Center Yoichi Sugimoto Senior Manager Active Safety, Daimler AG Joerg Breuer General Manager, DP-iSafety Dept., Information & Safety Systems Business Group, Denso Corp. Noriyuki Ido

• CAR-5 Future Automobile Society with Next-generation Telematics Jan. 20 [Fri] 13:30-16:00	CAR-10 Latest Processing and Material Technologies for Automotive Weight Reduction Jan. 20 [Fri] 13:30-16:00
  Senior Vice President, Strategic Planning, ITS Japan Shigeo Kobayashi Manager, IT and ITS Engineering Dept., Electronics Engineering Development Div., Nissan Motor Co., Ltd. Takashi Nomura Principal Architect, Technical Solutions, Application Platform Sales, Specialist Team Unit, Microsoft Japan Co., Ltd. Naoyuki Uchida	Head of Technology Development Production, AUDI AG Klaus Koglin General Manager, Steel Sheet, Plate & Structual Steel Company, Sumitomo Metal Industries, Ltd. Kiyoyuki Fukui General Manager, Automotive Center, Toray Industries, Inc. Toru Yamanaka

• All Sessions

  All Sessions Available in English / Japanese
  (*Keynote Sessions: English, Chinese, Korean & Japanese.)

• Concurrent Shows

  Other sessions on automotive-related technologies
  are also available at the concurrent shows.

• INJ-7 Perspectives and Challenges of Automotive Electronic Mounting Jan. 19 [Thur] 9:30-12:00	ICP-9 In-vehicle IC Packaging Technology for Automotive Electronics Jan. 20 [Fri] 9:30-12:00
  Director, Electronics Advanced Key Technology R&D Div., Electronics System Business Group, Denso Corp. Yukihide Niimi Manager, Production Technology Div., Process Technology Development Dept., CMK Corp. Noriyuki Saitoh Speaker information is soon to be announced.	Executive Officer, President of Automotive Electronics Div., BOSCH Corp., Japan Konrad F. Kaschek Director, IC Eng. Div. 3, DENSO Corp. Hiroshi Fujimoto Renesas Electronics Corp. Tatsuhiko Akiyama

• PWB-1 High-thermal Conductivity Resin Substrates with Growing Attention from Automotive and Smartphone Applications Jan. 18 [Wed] 9:30-12:00	INJ-8 Forefront of Power Device Mounting and Heat Radiation Technologies Jan. 19 [Thur] 13:30-16:00
  General Manager, Design Dept.4, Electronics Eng. Div.3, Denso Corp. Arihiro Kamiya Professor, Department of Advanced Materials Chemistry, Yokohama National University Akio Takahashi General Manager, Engineering Group, Printed Circuit Board Business Unit, Panasonic Electronic Devices Co., Ltd. Masaaki Katsumata	Chief Researcher, R&D Center, R&D Partnership for Future Power Electronics Technology Yoshinori Murakami Group Leader, Materials Characterization Dept., Central Research Institute, Denki Kagaku Kogyo Kabushiki Kaisha Kenji Monden Project Manager, Smart Grid Initiative, Senju Metal Industry Co., Ltd. Hayato Hiwatashi

• ICP-10 Most-current Development Trends in Power Devices for Power Saving Jan. 20 [Fri]13:30-16:00

  LIGHT-11 Growing LED Application -Automotive, Stage and Plant Factory Lighting- Jan. 18 [Wed] 9:30-12:00

  General Manager, Electronics Development Div. 3, Toyota Motor Corp. Kimimori Hamada Operating Officer and Electronic Device CTO, General Manager, Elevtronic Device Lab., Corporate R&D Headquarters, Fuji Electric Co., Ltd. Tatsuhiko Fujihira Dept. Manager, Automotive Power Device Design Dept., Power Devices Business Div., Analog & Power Devices Business Unit, Renesas Electronics Corp. Katsuo Ishizaka

  Senior Manager, Stage & Studio Lighting Control System Dept., Lighting Control & Communication Systems Div., Toshiba Lighting & Technology Corp. Takayuki Koshimizu General Manager, R&D Lab., Research & Development Center, Stanley Electric Co., Ltd. Mitsuo Yamada General Manager, Strategic Marketing Center, Corporate Technical Office, Showa Denko K.K. Hiroshi Suzuki

• (Honorifics omitted)

  * Please note that the speakers and programs are subject to change.
  * The photographic and video recording rights are reserved to the Show Management.
  *Textbooks of some sessions are not available.
  

  For more information, please contact: car-con@reedexpo.co.jp

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  Asia's Largest Scale! Learn the cutting-edge in 185 sessions.

  Choose and Click the ones of your interest for details.

  

  Latest technologies and industry trends will be addressed; from Lead-free Soldering, Micro Joint, Cutting-edge Testing Technologies, to Applications to the hottest fields such as Smartphones, Power Modules, etc.

  

  3 Dimensional Assembly, TSV, Copper Wire, In-vehicle Semiconductors, Power Devices, etc., the latest technology trends of IC Packaging.

  

  Device Embedded Substrates, Printed Electronics, Heat-resistant Technologies, FPC etc., the latest technologies and industry trends of PCBs.
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  EV/HEV, Motors, Secondary Batteries, Safety Technologies, the Key to Grab the Emerging Markets, etc., hottest topics in the industry.

  

  Industry trends, Strategies of leading companies, Element technologies, etc., various approaches to LED & OLED Lighting.